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COB (Chip On Board)

♦ COB LCM Mounting Technology

 

♦ Construction Of Wire Bonding

 

♦ PC Board & Layout

 

♦ PCB Constrain for COB

Parameter

General

Advance

Note

Unit

mm

mil

mm

mil

Pitch

0.394~0.473

10~12

0.178~0.228

7~9

 

Width

0.152

6

0.10~0.127

4~5

 

Spacing

0.10~0.152

4~6

0.076~0.102

3~4

 

Thickness

0.8

31.52

0.2~0.4

7.9~15.9

 

 

♦ Product Line

♦ Products

♦ Process PC Board & Layout 

 

♦ Process

  •  

    PCB cutting:

    PCB cut into proper size.
  •  

    PCB Cleaning:

    PCB cleaning
  •  

    Epoxy dripping:

    Epoxy dripping on PCB Pad
  •  

    Chip On Board:

    IC Chip on PCB Pad
  •  

    Baking:

    Baking for IC Chip fixed with Epoxy
  •  

    Wire Bonding:

    Wire Bonding between Chip & Bonding-pad
  •  

    PCB Dividing:

    PCB divided into pieces
  •  

    Inspection:

    COB Function inspection
  •  

    Epoxy Molding:

    Molding Chip & Wire by Epoxy
  •  

    Baking:

    Baking for Epoxy package
  •  

    Inspection:

    Quality inspection of Epoxy molding