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COB Process > > |
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COB (Chip On Board )
- COB(Chip On Board)Process
- Product Line:
- Products
- Process PC Board & Layout
LCM Mounting Technology
Construction Of Wire Bonding
PC Board & Layout
PCB Constrain for COB
| Parameter |
General |
Advance |
Note |
| Unit |
mm |
mil |
mm |
mil |
| Pitch |
0.394~0.473 |
10~12 |
0.178~0.228 |
7~9 |
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| Width |
0.152 |
6 |
0.10~0.127 |
4~5 |
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| Spacing |
0.10~0.152 |
4~6 |
0.076~0.102 |
3~4 |
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| Thickness |
0.8 |
31.52 |
0.2~0.4 |
7.9~15.9 |
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